TECHNICAL-TECHNOLOGICAL BASE

SSiC can be synthesized in any desired quantity starting from materials containing silicon and carbon under the use of electrical energy.

All base materials such as sand and carbon are abundantly available.

Final disposal removes the package material permanently from the raw material cycle. In contrast to the limited, worldwide existing copper reserves, the extended use of silicon carbide will not endanger material resources.

The manufacturing of SSiC-containers on industrial scale is feasible. With the laser bonding technique CERALINK^@ for SSiC components the key technology for encapsulation is available.

With this material and technological basis all important prerequisites for SSiC waste encapsulation on large scale are given.